Level conversion circuit

ABSTRACT

The collectors of differential pair transistors having their emitters connected to each other are connected to a positive power source voltage via respective load resistors. The emitters are connected to a negative power source voltage via a current source transistor. 
     The base bias voltage of the current source transistor is supplied from a bias circuit operating on the difference voltage between the positive power source voltage and the negative power source voltage. 
     When the positive power source voltage drops, the base bias voltage of the current source transistor drops in response thereto. Hence, the value of a current flowing through the current source transistor decreases. Due to this decrease of the current, the voltage drop of the load resistors decreases, thereby off-setting a low level potential of the collector output signals of the differential pair transistors. 
     Thus, the differential pair transistors are prevented from being driven into saturation.

BACKGROUND OF THE INVENTION

This invention relates to a level conversion circuit such as one used as the interface between the output of an ECL circuit and the input of a TTL circuit or an N-MOS circuit, for example.

Since the ECL (emitter coupled logic) circuit makes use of a negative power source voltage V_(EE), the signal level of the ECL circuit varies between ground potential (GND) and the negative power source voltage V_(EE). On the other hand, the TTL (transistor-transistor logic) circuit or the N-MOS (N channel insulated gate field effect transistor) circuit makes use of a positive power source voltage V_(CC) and hence, the signal level of the TTL circuit or of the N-MOS circuit varies between the positive power source voltage V_(CC) and ground potential (GND).

As the interface between the output of the first circuit operating on the negative power source voltage V_(EE) and the input of the second circuit operating on the positive power source voltage V_(CC), a signal level conversion circuit is necessary. In an IC₁ encompassed by the two-dot chain line in FIG. 1, a circuit indicated by l₂ is a heretofore known semiconductor integrated circuit, forming a signal level conversion circuit. A first power terminal of the ECL circuit l₁ is connected to the ground potential (GND) and a negative power source voltage V_(EE) (e.g., -5.2 V) is impressed upon a second power terminal P₂. Accordingly, the signal level of an output signal y obtained from an output terminal P₇ of the ECL circuit l₁ varies between the ground potential (GND) and the negative power source voltage V_(EE). A positive power source voltage V_(CC) (e.g., +5.0 V) is impressed upon a first power terminal P₁₀ of the TTL circuit l₃ and its second power terminal P₁₆ is connected to the ground potential (GND). Hence, the signal level of the TTL circuit l₃ varies between the positive power source voltage V_(CC) and ground potential (GND). The heretofore known level conversion circuit l₂ is disposed between the output terminal P₇ of the ECL circuit l₁ and the input terminal P₁₅ of the TTL circuit l₃.

The signal level conversion circuit l₂ includes a first input transistor Q₁₈ having its base connected to the first input terminal P₁₁, a second input transistor Q₁₇ having its base connected to the second input terminal P₁₂, a reference transistor Q₁₆ the base of which receives a negative second reference voltage V_(b2) generated by a reference voltage generation circuit 1 and a current source transistor Q₁₉ the base of which receives a negative first reference voltage V_(b1) generated by the reference voltage generation circuit 1. The reference voltage generation circuit 1 operates on the difference voltage between the negative power source voltage V_(EE) and the ground potential (GND) and includes transistors Q₉ and Q₁₀, diodes D₃ -D₆ and resistors R₇, R₉ and R₂₅. The emitter of the transistor Q₉ of the reference voltage generation circuit 1 is connected to a terminal P₁₃ and a negative third reference voltage V_(BB) is obtained from this terminal P₁₃.

The collector of the first input transistor Q₁₈ and that of the reference transistor Q₁₆ are connected to a first load resistor R₃₂ at a first node N₁ and the collector of the second input transistor Q₁₇ is connected to a second load resistor R₃₅ at a second node N₂. When the first node N₁ becomes high level, the first output transistor Q₃₂ becomes conductive and an output signal of high level approximate to the positive power source voltage V_(CC) is obtained at the output terminal P₁₄. On the other hand, when the second node N₂ becomes high level, the second output transistor Q₃₃ becomes conductive and an output signal of low level approximate to the ground potential (GND) is produced at the output terminal P₁₄. In this manner, the conversion output signal Y at the output terminal P₁₄ of the signal level conversion circuit l₂ varies substantially between the positive power source voltage V_(CC) and the ground potential (GND) and is transmitted to the input terminal P₁₅ of the TTL circuit l₃.

By means of the connection arrangement outside the semiconductor integrated circuit, the output signal y of the ECL circuit l₁ is applied to the first input terminal P₁₁ of the signal level conversion circuit l₂ while the third reference voltage V_(BB) is applied to the second input terminal P₁₂. In consequence, the phase of the conversion output signal Y at the output terminal P₁₄ of the signal level conversion circuit l₂ is opposite to the phase of the output signal y at the output terminal P₇ of the ECL circuit l₁.

Meanwhile, the negative power source voltage V_(EE) for the first circuit such as the ECL circuit l₁ and the positive power source voltage V_(CC) for the second circuit such as the TTL circuit involve the possibility of inducing the fluctuation of the power source voltages, respectively.

Further, the switching speed of the output signal Y at the output terminal P₁₄ of the signal level conversion circuit l₂ is determined by the switching characteristics of the first and second input transistors Q₁₈ and Q₁₇.

In order to keep the switching speed of the signal level conversion circuit l₂ at a high speed, therefore, the first and second input transistors Q₁₈ and Q₁₇ must be operated in the non-saturation mode. That is to say, when a bipolar transistor is driven into the saturation region, the base-collector junction is biased in the forward direction. Hence, the base layer and the collector layer cause minority carrier injection with each other and accumulation of this minority carrier markedly extends the switching time.

On the other hand, the reference voltage generation circuit 1 in the heretofore known signal level conversion circuit l₂ shown in FIG. 1 generates a first reference voltage V_(b1) which depends upon the negative power source voltage V_(EE) but not upon the positive power source voltage V_(CC), and by this first reference voltage V_(b1) is determined the value of a current I_(o) flowing through the current source transistor Q₁₉. Hence, the value of this current I_(o) depends upon the value of the negative power source voltage V_(EE) but not upon that of the positive power source voltage V_(CC).

Assume now that the output signal y at the output terminal P₇ of the ECL circuit l₁ is at a level which is approximate to the ground potential (GND). In this case, the second and third negative reference voltages V_(b2) and V_(BB) are impressed upon the base of the reference transistor Q₁₆ and upon that of the second input transistor Q₁₇, respectively. Hence, the first input transistor Q₁₈ becomes conductive while the reference transistor Q₁₆ and the second input transistor Q₁₇ remain non-conductive. Accordingly, the voltage V_(N1) at the first node N₁ is given by the following equation;

    V.sub.N1 =V.sub.CC -R.sub.32.I.sub.o                       ( 1)

When the negative power source voltage V_(EE) is kept at a predetermined power source voltage (e.g., -5.2 V) while the positive power source voltage V_(CC) drastically decreases from its predetermined power source voltage (e.g., +5.0 V) down to +3.0 V, for example, the first item on the right side of the above-mentioned equation (1) becomes smaller than the second item and hence, the voltage V_(N1) at the first node N₁ becomes a negative voltage.

On the other hand, when the positive power source voltage V_(CC) is kept at a predetermined power source voltage (e.g., 5.0 V) while the negative power source voltage V_(EE) drastically increases from its predetermined power source voltage (e.g., -5.2 V) up to -7.0 V, for example, the value of the current I_(o) flowing through the current source transistor Q₁₉ increases. Due to the increase of the current, therefore, the second item of the equation (1) becomes greater than the first item. Thus, the voltage at the first node N₁ becomes likewise a negative voltage.

Thus, the voltage V_(N1) at the first node N₁ becomes a negative value due to the decrease of the positive power source voltage V_(CC) or to the increase of the negative power source voltage V_(EE). At this time, since the output signal y, which is impressed upon the base of the first input transistor Q₁₈, is at a level of the ground potential (GND), the collector-base junction of the first input transistor Q₁₈ is biased in the forward direction and the first input transistor Q₁₈ is driven into the saturation region.

On the other hand, when the third reference voltage V_(BB) is impressed upon the base of the first input transistor Q₁₈ and the output signal y of the ECL circuit l₁ is impressed upon the base of the second input transistor Q₁₇ in accordance with logic design of a data processing system, the voltage of the second node N₂ becomes negative owing to the decrease of the positive power source voltage V_(CC) or to the increase of the negative power source voltage V_(EE) and the second input transistor Q₁₇ is likewise driven into the saturation region.

In this manner, the saturation of the first input transistor Q₁₈ or that of the second input transistor Q₁₇, due to the fluctuation in the source voltage of the positive power source voltage V_(CC) or the negative power source voltage V_(EE), markedly retards the switching speed of the output signal Y at the output terminal P₁₄ of the signal level conversion circuit l₂.

To cope with the problem, a method has conventionally been proposed which prevents the saturation of the input transistor by connecting a clamping element such as a Shottky barrier diode to the collector of the input transistors of the signal level conversion circuit, as disclosed in Japanese Patent Laid-Open No. 51-120143, for example.

Though the clamping element such as the Shottky barrier diode is capable of preventing the saturation of the input transistors, the switching speed of the output signal of the signal level conversion circuit is retarded due to the parasitic capacity inherent to the clamping element.

Referring again to the heretofore known signal level conversion circuit shown in FIG. 1, it has been clarified that when the absolute value |V_(EE) | of the negative power source voltage -V_(EE) becomes below about 4 V, the reference transistor Q₁₆ as well as the current source transistor Q₁₉ are brought into the OFF state. It has also been clarified that the collector outputs V_(N2), V_(N1) of the transistors Q₁₇, Q₁₈ are at high levels irrespective of the input conditions as represented by the power source voltage characteristic l₇₁ in FIG. 7 whereby degradation of the characteristics of the output transistors Q₃₂ and Q₃₃ and their break-down occur.

This is because when the absolute value |V_(EE) | of the negative power source voltage is not higher than about 4 V due to the base-emitter voltage of the transistor Q₉, to the voltages of the diodes D₃ and D₄ in the forward direction, to the collector-base voltage of the current source transistor Q₁₉ and to the voltage drop across the resistors R₇ and R₂₁, no current flows through them any longer.

SUMMARY OF THE INVENTION

It is therefore a first object of the present invention to provide a signal level conversion circuit having an expanded range of allowance for the fluctuation of power source voltages which is capable of high speed switching action to follow up the fluctuation of a negative power source voltage for a first circuit or that of a positive power source voltage for a second circuit.

It is a second object of the present invention to provide a level conversion circuit which improves a characteristic of a reduced power source voltage.

In a signal level conversion circuit l₂ (shown in FIG. 2) in accordance with the fundamental principle of the present invention to accomplish the above-described first object, the value of a current I_(o) flowing through a current source transistor Q₁₉ connected to input transistors Q₁₇ and Q₁₈ depends upon both negative power source voltage V_(EE) and positive power source voltage V_(CC). The value of the current I_(o) flowing through the current source transistor Q₁₉ is proportional to the difference of voltages between the negative power source voltage V_(EE) and the positive power source voltage V_(CC). Accordingly, when the value of the positive power source voltage V_(CC) decreases, for example, the voltage drop across load resistors R₁₈ and R₁₉ connected between the positive power source voltage V_(CC) and collectors of input transistors Q₁₇ and Q₁₈ is reduced due to the decrease of the current flowing through the current source transistor Q₁₉. Hence, the drop of the collector potentials of the input transistors Q₁₇ and Q₁₈ resulting from the decrease of the positive power source V_(CC) is offset by the decrease of the voltage drop across the load resistors R₁₈ and R₁₉.

In the level conversion circuit (FIG. 8) in accordance with the fundamental principle of the present invention to accomplish the above-described second object, a bias voltage V_(N4) for a protection transistor Q₁₂ and a bias voltage V_(N7) for a constant current transistor Q₁₅ are formed on the basis of a voltage division output of a voltage division circuit 2 disposed between the positive power source voltage V_(CC) and the negative power source voltage V_(EE).

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a circuit diagram of the heretofore known circuit;

FIG. 2 is a circuit diagram of an embodiment of the present invention;

FIG. 3 is a block diagram of a MOS memory;

FIG. 4 is a circuit diagram of a memory cell and preamplifier;

FIG. 5 is a characteristic curve of the circuit of FIG. 2;

FIG. 6 is a waveform chart of the MOS memory circuit of FIG. 3;

FIG. 7 is a characteristic curve of the circuit of FIGS. 1 and 8; and

FIG. 8 is a circuit diagram of another embodiment of the present invention;

DESCRIPTION OF THE PREFERRED EMBODIMENT

Hereinafter, the preferred embodiments of the present invention will be explained in detail.

FIG. 2 is a circuit diagram showing the signal level conversion circuit l₂ of an embodiment of the present invention together with the ECL circuit l₁ and the N-MOS memory l₃.

Though not limited in particular, the abovementioned ECL circuit l₁ comprises a bias circuit consisting of resistors R₁ -R₃, diodes D₁ and D₂ and a transistor Q₁ and a logic circuit consisting of resistors R₄ -R₆ and transistors Q₂ -Q₇ as shown in the drawing.

Input signals a-c from terminals P₃ -P₅ are impressed upon the bases of the transistors Q₃ -Q₅, respectively. At the emitter (output terminal P₇) of the transistor Q₇ is produced an output signal of the NOR logic y of the signals a-c.

One of power terminals P₁ of the abovementioned ECL circuit l₁ is connected to a ground potential point (GND) of the circuit and the other P₂ is connected to a negative power terminal V_(EE) of -5.2 V, for example. The input and outputs signals of the ECL circuit l₁ are set to a high level of -0.89 V, for example, and to a low level of -1.69 V, for example, respectively.

The signal level conversion circuit l₂ in accordance with the embodiment of the present invention is formed on one semiconductor substrate by a known monolithic semiconductor integrated circuit technique.

One of power terminals P₈ of this signal level conversion circuit is connected to a positive power terminal V_(CC) of 5 V, for example, the second P₉, to the negative power terminal V_(EE) and the third P₁₀, to the ground potential point (GND).

The bias circuit 2 is especially connected between the positive power terminal V_(CC) and the negative power terminal V_(EE) in accordance with the principle of the present invention as shown in the drawing and operates on the voltage difference between the positive power source and the negative power source. The bias circuit 2 produces a bias voltage V_(BB) which is at an almost intermediate level of the ECL signal level, e.g., -1.29 V, at the junction between the emitter of the transistor Q₉ and the anode of the diode D₃ and also produces a bias voltage V_(b2) which is lower than the low level of the ECL signal level, e.g., -1.69 V, at the junction between the cathode of the diode D₄ and the collector of the transistor Q₁₀. It also produces a bias voltage V_(b1) for a current source transistor Q₁₉ at the junction between the emitter of the transistor Q₁₀ and the resistor R₆, and a bias voltage V_(b3) for the transistor Q₁₁ at the junction between the resistor R₉ and the resistor R₁₀.

In the level conversion circuit l₂, the transistor Q₁₉ forms a current source transistor, the transistor Q₁₈ forms a first input transistor and the transistor Q₁₇ forms a second input transistor.

At its base, the abovementioned second input transistor Q₁₇ receives the reference bias voltage V_(BB) of the intermediate level of the ECL signal level from the constant voltage bias circuit 2 via terminals P₁₃ and P₁₂ while the transistor Q₁₈ receives the output signal y from the abovementioned ECL circuit l_(l) via the terminals P₇ and P₁₁. To these first and second input transistors Q₁₈ and Q₁₇ is connected a reference transistor Q₁₆ so as to be capable of operating differentially. The bias voltage V_(b2) from the bias circuit 2 is applied to the base of this reference transistor Q₁₆. Accordingly, when the output signal y of the abovementioned ECL circuit l₁ is at high level, the transistor Q₁₇ is in the OFF state while the transistor Q₁₈ is in the ON state. On the contrary, when the output signal y of the ECL circuit l₁ is at low level, the state of each transistor Q₁₇, Q₁₈ is reversed.

The collector of the first input transistor Q₁₈ is connected to the positive power terminal V_(CC) via a first load resistor R₁₉ and the collector of the second input transistor Q₁₇ is also connected to the positive power terminal V_(CC) via a second load resistor R₁₈.

When the transistor Q₁₇ or Q₁₈ is turned on, a current I_(o) of the current source transistor Q₁₉ flows through the resistor R₁₈ or R₁₉, thus generating a voltage drop at the resistor R₁₈ or R₁₉. As a result, a signal of the opposite phase is produced at the collector of each transistor Q₁₇, Q₁₈ in accordance with the input signal of the ECL level. In this case, it is possible to render the low level of the collector output signal of each transistor Q₁₇, Q₁₈ substantially equal to the ground potential (GND) such as +0.3 V, for example, by selecting suitable values for the resistors R₁₈ and R₁₉.

The collector output signals of the transistors Q₁₇ and Q₁₈ are respectively applied to the bases of cascaded output transistors Q₂₁ and Q₂₃ via emitter follower transistors Q₂₀ and Q₂₂. The output transistors Q₂₁ and Q₂₃ are operated in the opposite phases to one another by the collector outputs of the differential pair transistors Q₁₇ and Q₁₈. As a result, at the output terminal P₁₄, there is produced an output signal Y which is converted into a positive voltage system in response to the input signal of the ECL level and is capable of sufficiently driving a heavy load such as a capacitive load.

The output signal Y of the signal level conversion circuit l₂ substantially changes between the positive power source voltage V_(CC) and the ground potential point (GND) and is impressed upon the input terminal P₁₅ of the N channel MOS circuit l₃. The N-MOS circuit l₃ includes N-channel insulated gate field effect transistors Q₂₃, Q₂₄, Q₂₅, Q₂₆ and Q₂₇. One of its power terminals P₁₀ is connected to the positive power terminal of +5.0 V, for example, while the other power terminal P₁₆ is connected to the ground potential point (GND).

In the bias circuit 2 in accordance with the principle of the present invention, resistors R₂₅ and R₁₃ are connected in series between the positive power terminal V_(CC) and the negative power terminal V_(EE). The voltage produced at the junction of these resistors R₂₅ and R₁₃ is proportional to the difference of the voltage between the positive power voltage V_(CC) and the negative power voltage V_(EE) and determines the bias voltage V_(b1) to be impressed upon the base of the current source transistor Q₁₉. Though the junction between the resistors R₂₅ and R₁₃ may be directly connected to the base of the current source transistor Q₁₉, it is preferably connected to the base of the current source transistor Q₁₉ via the base-emitter junction of the emitter follower transistor Q₁₀. In a further preferred embodiment of the present invention, the diodes D₅ and D₆ are connected in series to the resistor R₁₃ for the compensation of the temperature characteristic of the base-emitter junctions of the transistors Q₁₀ and Q₁₉.

In the preferred embodiment of the present invention, resistors R₁₁ and R₂₇ are cascaded between the ground potential point (GND) and the negative power terminal V_(EE) in the bias circuit 2. The voltage produced at the junction between these resistors R₁₁ and R₂₇ is proportional to the power source voltage of the negative power voltage V_(EE) and determines the reference bias voltage V_(BB) as well as the bias voltage V_(b2).

Assume now that the output signal y at the output terminal P₇ of the ECL circuit l₁ is at a level approximate to the ground potential (GND). Since the bias voltage V_(b2) and the bias voltage V_(BB) are impressed upon the base of the reference transistor Q₁₆ and upon that of the second input transistor Q₁₇, respectively, the first input transistor Q₁₈ becomes conductive whereas the reference transistor Q₁₆ and the second input transistor Q₁₇ become non-conductive. Accordingly, the potential V_(N1) at the first node N₁ where the first load resistor R₁₉ is connected to the collector of the first input transistor Q₁₈ is given by the following equation;

    V.sub.N1 =V.sub.CC -R.sub.19 ·I.sub.o             (2)

On the other hand, the value of the current I_(o) flowing through the current source transistor Q₁₉ is especially rendered proportional to the voltage difference between the positive power source voltage V_(CC) and the negative power source voltage V_(EE) in accordance with the principle of the present invention.

Accordingly, when the negative power source voltage V_(EE) is kept at a predetermined power source voltage value (e.g., -5.2 V) while the positive power source voltage V_(CC) drops drastically from a predetermined power source voltage (e.g., +5.0 V) down to +3.0 V, for example, the value of the current I_(o) flowing through the current source transistor Q₁₉ drops drastically. For this reason, even when the power source voltage value of the positive power source voltage V_(CC) drops drastically from the predetermined value, the first and second items of the right side of the abovementioned equation (2) become small values.

Assume now the case where the positive power source voltage V_(CC) is kept at a predetermined power source voltage value (e.g., 5.0 V) while the negative power source voltage V_(EE) changes drastically (from -5.2 V, for example) to -7.0 V, for example. In this case, in the heretofore known signal level conversion circuit l₂ (in FIG. 1), the value of the current I_(o) flowing through the current source transistor Q₁₉ changes drastically depending exclusively upon the voltage value of the negative power source voltage V_(EE), whereas in the signal level conversion circuit l₂ of the present invention (in FIG. 2), the value of the current I_(o) flowing through the current source transistor Q₁₉ is determined by the voltage difference between the positive power source voltage V_(CC) and the negative power source voltage V_(EE). Accordingly, the change of the current I_(o) due to the change of the negative power source voltage V_(EE) becomes smaller than that in the prior art.

As described above, since the value of the current I_(o) flowing through the current source transistor Q₁₉ changes in proportion to the voltage difference between the positive power source voltage V_(CC) and the negative power source voltage V_(EE) in the present invention, the potential V_(N1) at the first node N₁ does not much change with the change of the positive power source voltage V_(CC) or that of the negative power source voltage V_(EE) and is kept substantially at a constant level.

On the other hand, it has become obvious that when the positive power source voltage and the negative power source voltage to be used change or when the sequence of the feed changes in making use of the signal level conversion circuit, signals of undesirable levels are applied to the N-MOS memory so that the memory tends to operate erroneously.

As will be explained next, the signal level conversion circuit l₂ (in FIG. 2) in accordance with the embodiment of the present invention operates in such a manner as to keep the output signal Y of the push-pull output circuit (Q₂₁, Q₂₃) at a preferable high level even in such cases where the power source voltages V_(CC) and V_(EE) fluctuate, the feed sequence of the voltages V_(CC) and V_(EE) changes at the start of the feed of power and the input terminals P₁₁ and P₁₂ undesirably open.

The reason why the signals of undesirable levels are applied to the N-MOS memory due to the change in the negative power source voltage V_(EE) in the signal level conversion circuit l₂ (in FIG. 2) will be discussed. The reason resides in the fact that the negative power source voltage has such a critical value V_(EE) (crit) that when the power source voltage decreases, the bias current flowing through the series current path consisting of the transistor Q₉, the diodes D₃ and D₄, the transistor Q₁₀ and the resistors R₉ and R₁₀ of the constant voltage bias circuit 2 becomes substantially zero. When the absolute value of the negative power source voltage V_(EE) becomes lower than this critical value V_(EE) (crit), the bias voltage V_(b1) obtained from the emitter of the transistor Q₁₀ becomes substantially zero and the current source transistor Q₁₉ is eventually cut off.

The cut-off state of the constant current transistor Q₁₉ brings both differential pair transistors Q₁₇ and Q₁₈ into the OFF state.

When the switching transistor Q₁₅ is not disposed in the V_(EE) detection circuit 3 and in the switching circuit 4, both collector outputs of the differential pair transistors Q₁₇ and Q₁₈ become simultaneously high level upon turn-off of both transistors whereby all of the emitter follower transistors Q₂₀, Q₂₂ and the output transistors Q₂₃, Q₂₁ of the push-pull circuit of the signal level conversion circuit l₂ (in FIG. 2) are turned on. This state not only produces, as the output signal Y, the low level (ground potential) causing the erroneous operation of the N-MOS memory from the output terminal P₁₄ but also allows a large current to simultaneously flow through the output transistors Q₂₃ and Q₂₁ and to eventually break down these transistors.

By contrast, in accordance with the embodiment of the present invention, there are provided the V_(EE) detection control circuit 3 and the switching circuit 4. More particularly, the base of the detection transistor Q₁₁ in the V_(EE) detection circuit 3 is connected to the junction between the resistors R₉ and R₁₀ and is supplied with a bias voltage V_(b3) which is smaller than the bias voltage V_(b1) obtained from the emitter of the transistor Q₁₀. Accordingly, the transistor Q₁₁ of the V_(EE) detection control circuit 3 is cut off before the current source transistor Q₁₉ is cut off when the absolute value of the negative power source voltage V_(EE) becomes smaller than the abovementioned critical value V_(EE) (crit). Hence, the collector output of the transistor Q₁₁ becomes high level (positive power source voltage V_(CC)) and the transistor Q₁₅ of the switching circuit 4 is in the ON state. Since the collector of the transistor Q₁₅ is connected to the base of the emitter follower transistor Q₂₀ of the push-pull output circuit, the emitter follower transistor Q₂₀ as well as the output transistor Q₂₁ become in the OFF state as soon as the transistor Q₁₅ is turned on. As the output transistor Q₂₁ is in the OFF state, both emitter follower transistor Q₂₂ and output transistor Q₂₃ become ON whereby the output signal Y of the high level is obtained from the output terminal P₁₄ and the output transistors Q₂₁ and Q₂₃ can be protected from the break-down.

Accordingly, in the V_(EE) detection control circuit 3 and in the switching circuit 4, the negative power source voltage V_(EE) changes from the right-hand portion to the left as viewed from the line l₅₁ in FIG. 5 and when it exceeds the line l₅₁, it changes compulsively the output signal Y of the output terminal P₁₄ to the high level. The value of the positive power source voltage V_(CC) required for the V_(EE) detection control circuit 3 and the switching circuit 4 to accomplish this compulsive circuit operation is a minimum value required for the transistor Q₁₅ to be brought into the ON state by means of the current flowing through the base of the transistor Q₁₅ of the switching circuit 4 through the resistor R₂₆.

On the other hand, voltages of suitable values are applied to the positive power source voltage V_(CC) and to the negative power source voltage V_(EE), respectively. When the output signal y of the ECL circuit l₁ is at low level, one transistor Q₁₇ of the differential pair transistors Q₁₇ and Q₁₈ is in the ON state and its collector output is at low level while the other transistor Q₁₈ is in the OFF state. In this case, the low level collector output of the transistor Q₁₇ brings the transistors Q₂₀ and Q₂₁ of the push-pull output circuit into the OFF state while the high level collector output of the transistor Q₁₈ brings the transistors Q₂₂ and Q₂₃ of the push-pull output circuit into the ON state.

However, there is a possibility that even when the output signal y of the ECL circuit l₁ is at low level and the transistor Q₁₈ is in the OFF state with the transistor Q₁₇ in the ON state, the low level collector output of the transistor Q₁₇ changes to follow up the change in the positive power source voltage V_(CC) or in the negative power source voltage V_(EE).

In other words, if the V_(CC) ·V_(EE) detector circuit 1 and the switching circuit 4 are not provided, the voltage level of the low level collector output of the transistor Q₁₇, which is in the ON state, becomes (V_(N2) =V_(CC) -R₁₈ ·I_(o)) with I_(o) being a constant current flowing through the current source transistor Q₁₉. Accordingly, the voltage level of the collector output of the transistor Q₁₇ changes from the low level towards the high level in accordance with the rise of the absolute value of the positive power source voltage V_(CC) or with the decrease of the constant current I_(o). The decrease of the constant current I_(o) flowing through the current source transistor Q₁₉ is generated by the decrease of the absolute value of the negative power source voltage V_(EE). When the voltage level of the low level collector output of the transistor Q₁₇ expressed by (V_(N2) =V_(CC) -R₁₈ ·I_(o)) changes towards the high level due to the rise of the absolute value of the positive power source voltage V_(CC) or to the decrease of the absolute value of the negative power source voltage V_(EE), the transistors Q₂₀ and Q₂₁ of the output push-pull circuit become in the ON state. At this time, the other Q₁₈ of the differential pair transistors Q₁₇ and Q₁₈ is in the OFF state and the transistors Q₂₂ and Q₂₃ of the output push-pull circuit have already been in the ON state. Hence, there occurs a possibility that the output transistors Q₂₃ and Q₂₁ are broken down due to a penetrating current flowing their series circuit and a low level output signal Y is undesirably generated at the output terminal P₁₄ as the output transistor Q₂₁ is in the ON state.

By contrast, in accordance with the embodiment l₂ (in FIG. 2) of the present invention, there are provided the V_(CC) ·V_(EE) detection circuit 1 and the switching circuit 4. Especially, the base of the detection transistor Q₈ in the V_(CC) ·V_(EE) detection circuit 1 is connected to the positive power source voltage V_(CC) via the resistor R₁₄ and the emitter is connected to a common junction of the two cascaded resistors R₇ and R₂₅ between the positive power source voltage V_(CC) and the negative power source voltage V_(EE) with the collector connected to the base of the emitter follower transistor Q₁₂. The emitter of this transistor Q₁₂ is connected to a circuit network consisting of the resistors R₁₆, R₁₇ and the transistor Q₁₃ and further to the base of the switching transistor Q₁₄.

Accordingly, when the rise of the absolute value of the positive power source voltage V_(CC) or the drop of the absolute value of the negative power source voltage V_(EE) exceeds a detection level that is determined by the resistors R₇, R₂₅, R₁₃, the diodes D₅, D₆ and so forth, the emitter voltage of this detection transistor Q₈ rises. As a result, a sufficient base current is fed to the emitter follower transistor Q₁₂ via a Shottky diode interposed between the collector and base of the detection transistor Q₈, whereby the switching transistor Q₁₄ is turned ON. As the transistor Q₁₄ is thus in the ON state, it protects the output transistors Q₂₁ and Q₂₃ from break-down in the same way as the switching transistor Q₁₅ and changes the output signal Y at the output terminal P₁₄ to the high level.

In FIG. 5, the range above the line l₅₂ represents a range of the power source voltage in which the transistor Q₁₄ of the abovementioned switching circuit 4 is in the ON state. In other words, when the absolute value of the positive power source voltage rises or the absolute value of the negative power source voltage drops, the power source voltage value approaches from the range below the line l₅₂ towards the upper range so that when the power source voltage exceeds the line l₅₂ before the transistors Q₂₀ and Q₂₁ change undesirably from the OFF state to the ON state, the transistor Q₁₄ of the switching circuit 4 becomes ON. It is thus possible to keep the transistors Q₂₀ and Q₂₁ of the output push-pull circuit in the OFF state.

The reference transistor Q₁₆ is employed in order to compulsively keep the signal of the output terminal P₁₄ at the high level when the terminals P₁₁ and P₁₂ are undesirably opened. Namely, when the terminals P₁₁ and P₁₂ are opened, the transistors Q₁₇ and Q₁₈ become OFF since the base current becomes zero (O). The emitter of the transistor Q₁₆ is commonly connected to those of the transistors Q₁₇ and Q₁₈ and forms a current switch together with these transistors Q₁₇ and Q₁₈. Hence, when the transistors Q₁₇ and Q₁₈ become OFF, the reference transistor Q₁₆ becomes ON. As a result, the constant current I_(o) of the current source transistor Q₁₉ flows through the resistor R₁₈ via the transistor Q₁₆. Due to the voltage drop of the resistor R₁₈, the transistors Q₂₀ and Q₂₁ become OFF with the consequence that the signal of the output terminal P₁₄ becomes high level.

As described above, the transistor Q₁₆ is arranged in such a manner that its base receives from the constant voltage bias circuit a bias voltage of a lower voltage level than the ECL signal level. Consequently, the transistor Q₁₆ is in the OFF state while the ECL level signal and the signal of the aforementioned intermediate level are applied to the terminals P₁₁ and P₁₂.

Heretofore known N-MOS memories may be used in the present invention without any restriction in particular. As shown in the block diagram of FIG. 3, for example, the N-MOS memory consists of a clock signal generation circuit 6 which receives a row address strobe signal RAS and generates a clock signal for a row address data input; a clock signal generation circuit 8 which receives the row address strobe signal RAS and a column address strobe signal CAS through a gate circuit 7 and generates a clock signal for the column address data input; a control circuit 9 which receives the clock signals from the clock signal generating circuits 6 and 8 and controls an address buffer circuit 13 and an address decoder circuit 14; a buffer circuit 10 which receives a chip selection signal CS; a gate circuit 12 which receives the output signals of the clock signal generation circuit 8 and the buffer circuit 10 and produces enable signals to the address decoder circuit 14 and to a data buffer circuit 17; a gate circuit 11 which receives a write control signal WRITE and the output signal of the gate circuit 7 and controls a write clock signal generation circuit 15; a data input buffer circuit 16 which is controlled by the output signal of the write clock signal generation circuit 15; memory arrays 18 and 18'; preamplifier groups 19; and an input-output data selection circuit 20.

FIG. 4 shows an example of the memory cell and preamplifier. As shown in the drawing, the memory cell comprises, for example, an N channel insulated gate field effect transistor (hereinafter called "MOSFET") Q₁₀₀ having its gate connected to the word line W_(o) of the address decoder circuit 14, and a data storage capacitor C₁₀₀. The preamplifier comprises MOSFETs Q₁₀₂ and Q₁₀₃ for receiving the clock signal φ₁ and MOSFET Q₁₀₄ for receiving the clock signal φ₀ and MOSFETs Q₁₀₅ and Q₁₀₆ having their gates and drains mutually connected crosswise. To the data line D₁ of the preamplifier is connected a dummy cell (Q₁₀₇, C₁₀₇) for providing a reference potential to the data line D₁, said reference potential determined when a memory to be connected to the data line D₁ is selected. To the data line D₁ is likewise connected a dummy cell (Q₁₀₁, C₁₀₁).

Generally, the N-MOS memory is equipped at its input terminals with an inverter having a bootstrap function as a buffer circuit and receives the low level of the input signal as a data signal, for the reason to be later explained.

Though not restrictive, the input buffer circuit 5 of FIG. 3 comprises the MOSFETs Q₂₃ -Q₂₇ and the capacitor C₁ like the circuit 5 of FIG. 2, for example. The MOSFETs Q₂₃ -Q₂₅ and the capacitor C₁ together form the inverter circuit while the MOSFETs Q₂₆ and Q₂₇ together form the push-pull circuit.

When the signal of the terminal P₁₅ is at high level, the MOSFET Q₂₃ is turned on and hence, the output of the inverter circuit is at low level substantially equal to the ground potential. At this time, the capacitor C₁ is charged to a value [V_(CC) -V_(th) ] which is the balance obtained by subtracting the threshold voltage V_(th) of the diode-connected MOSFET Q₂₄ from the approximate power source voltage V_(CC).

When the signal of the terminal P₁₅ changes from the abovementioned high level to low level, the MOSFET Q₂₃ is in the OFF state so that the output signal level of the inverter circuit starts rising. In this case, since the capacitor C₁ has in advance been charged near the above-mentioned value [V_(CC) -V_(th) ], the gate voltage of the MOSFET Q₂₅ becomes sufficiently high. As a result, the ON-resistance of the MOSFET Q₂₅ becomes sufficiently small. As the ON-resistance of the MOSFET Q₂₅ becomes sufficiently low, the stray capacitance (not shown) at the output side of the inverter circuit is rapidly charged and the output signal of the inverter circuit rises at a high speed. When the gate voltage of the MOSFET Q₂₅ becomes higher than the power source voltage V_(CC) owing to the bootstrap effect of the capacitor C₁, the output signal level of the inverter circuit rises close to the power source voltage V_(CC), although the MOSFET Q₂₅ has the threshold voltage.

While a steady low level signal is being applied to the terminal P₁₅, the stored charge of the capacitor C₁ is reduced by a leakage current and the output voltage of the inverter circuit rises only to a value [V_(CC) -2V_(th) ] which is the difference obtained by subtracting the threshold voltage V_(th) of the MOSFET Q₂₄ and that of the Q₂₅ from the power source voltage V_(CC). When the signal of the terminal P₁₅ is changed from the low level to the high level, therefore, the amplitude of the output signal of the inverter circuit becomes small so that the amplitude and the changing speed of the output circuit (Q₂₆, Q₂₇) become small correspondingly.

In order to increase the operation speed, the MOS memory is allowed to receive such signals that are at high level H at the time of non-operation and are at low level L at the time of operation as represented by A and B in FIG. 6.

In FIG. 6, A represents the change of the row address strobe signal RAS and B represents the change of the column address strobe signal CAS. Symbol C represents the change of the output signal of the inverter circuit (in FIG. 2) to receive the abovementioned signal RAS. Dash line a represents the change of the gate potential of the MOSFET Q₂₅ at this time.

As described above, the MOS memory driving circuit l₂ of the embodiment of the invention shown in FIG. 2 is so constructed as to generate the high level signal when it is not expected to operate normally due to the fluctuation of the power source voltage V_(CC) ·V_(EE), change of the mode of feeding the power source voltages V_(CC) and V_(EE), the state of opening of the input terminals P₁₁ and P₁₂, and so forth. Hence, the MOS memory is prevented from operating erroneously.

FIG. 8 shows the signal level conversion circuit in accordance with the embodiment of the present invention, which accomplishes the second object of the invention. This circuit is constructed in the monolithic semiconductor integrated circuit (IC) by the known technique and P₁ through P₇ are employed as external terminals of the IC.

To the terminal P₁ is applied a positive power source voltage V_(CC) of +5 V, for example, while a negative power source voltage of -5.2 V, for example, is applied to the terminal P₇. The terminal P₃ is kept at the ground potential (GND) of the circuit.

In the drawing, the portion encompassed by two-dot chain line 1 forms a level conversion portion and the portions encompassed by two-dot chain lines 2 and 3 form bias portions, respectively.

The bias portion 2 consists of resistors R₇ -R₁₀, a transistor Q₄ and diodes D₁₁ -D₁₃, and is interposed between the abovementioned terminals P₁ and P₇. Upon receiving the positive power source voltage V_(CC) and the negative power source voltage V_(EE), the bias portion 2 generates bias voltages at nodes N₃ -N₅, respectively.

The bias voltage V_(N3) at the node N₃ is utilized as a bias voltage for a power source voltage detection portion 5. The voltage value of this bias voltage V_(N3) is set such that it is lower than 2 V_(BE), the sum of the base-emitter voltage V_(BE) in the forward direction of a transistor Q₆ and that of a transistor Q₈ of the power source voltage detection portion 5 when the power source voltages V_(CC) and V_(EE) are within the normal ranges. On the other hand, the bias voltage V_(N3) is set such that it becomes higher than 2 V_(BE) when the positive power source voltage V_(CC) increases from the normal value and when the absolute value of the negative power source voltage V_(EE) decreases from the normal value.

The bias voltage V_(N4) is utilized as a bias voltage for a transistor Q₁₂ of the level conversion portion 1. This bias voltage V_(N4) is set such that it is at a lower level than the level of the ECL signal applied to the external terminal P₄ or P₅ of the IC.

The bias voltage V_(N5) at the node N₅ is utilized as a bias voltage for a transistor Q₁₀ of the bias portion 3.

The bias portion 3 consists of resistors R₁₅ through R₁₇, diodes D₁₄ and D₁₅ and transistors Q₉ and Q₁₀ and is interposed between the ground (GND) and the negative power source terminal P₇ of the circuit. This bias portion 3 produces bias voltages V_(B) and V_(N7) at the nodes N₆ and N₇, respectively.

The bias voltage V_(B) at the node N₆ is set to the intermediate level of the level of the ECL signal. When the high level of the ECL signal is -0.89 V with the low level being -1.69 V, the reference bias voltage V_(B) at the node N₆ is set to -1.29 V by selecting suitable values for the resistors R₁₅ and R₁₆.

The bias voltage V_(N7) at the node N₇ is utilized as a bias voltage for a current source transistor Q₁₅ of the level conversion portion 1.

The level conversion portion 1 consists of the above-mentioned current source transistor Q₁₅ having an emitter resistor R₂₄, differential pair transistors Q₁₃ and Q₁₄ with their respective collector load resistors R₁₉ and R₂₀, transistors Q₁₆ -Q₁₉ of a single end push-pull construction in the Darlington arrangement and resistors R₂₁ -R₂₃, and is interposed between the power terminals P₁ and P₇.

Though not restrictive, the output signal A from an ECL circuit (not shown) is applied to the terminal P₄ while the reference bias voltage V_(B) is fed to the terminal P₅ from the bias portion P₃ via the terminal P₆ by the connection of the terminals P₅ and P₆ outside the IC as shown in the drawing.

Consequently, the abovementioned differential pair transistors Q₁₃ and Q₁₄ perform the differential operation in accordance with the ECL signal A supplied to the terminal P₄.

Namely, when the ECL signal A is at low level, the transistor Q₁₃ becomes conductive and the transistor Q₁₄, non-conductive. At this time a current flows from the resistor R₁₉ via the transistor Q₁₃ to the current source transistor Q₁₅. The potential V_(N2) at the node N₂ is substantially at the ground potential (GND) e.g., +0.3 V, and the level of the potential at the node N₂ is at low level as the resistance of the resistor R₁₉ and the current value of the current flowing through the current source transistor Q₁₅ are suitably selected. On the other hand, as one Q₁₄ of the differential pair transistors Q₁₃ and Q₁₄ becomes non-conductive, the potential V_(N1) at the node N₁ is substantially equal to the positive power source voltage V_(CC) and the level of the potential at the node N₁ is at high level.

When the level of the potential at the node N₂ becomes low level, the Darlington-connected transistors Q₁₈ and Q₁₉ become non-conductive. When the level of the potential at the node N₁ becomes high level, the Darlington-connected transistors Q₁₆ and Q₁₇ become conductive. As a result, a high level signal having a voltage value approximate to [V_(CC) -2·V_(EE) ] is generated at the output terminal P₂.

On the contrary, when the ECL signal A is at high level, the state of operation of the differential pair transistors Q₁₃ and Q₁₄ is reversed to the above. In other words, the potential V_(N1) at the node N₁ is made substantially equal to the ground potential (GND) by suitably selecting in advance the resistance of the resistor R₂₀ and the current value of the current flowing through the current source transistor Q₁₅. At this time, since the level of the potential at the node N₂ is at high level, the Darlington-connected transistors Q₁₈ and Q₁₉ become conductive, while the Darlington-connected transistors Q₁₆ and Q₁₇ become non-conductive as the level of the potential at the node N₁ is at low level. In consequence, a low level signal substantially equal to the ground potential (GND) is produced at the output terminal P₂.

The abovementioned level conversion portion 1 drives the transistors Q₁₆, Q₁₇, Q₁₈ and Q₁₉ of the push-pull construction by means of the differential outputs at the nodes N₁ and N₂, thereby ensuring the high speed operation even if considerable stray capacitance (not shown) exists at each circuit point. Unlike the abovementioned circuit construction, there is a method which employs a phase split transistor such as one used in the heretofore known TTL circuit and derives signals of opposite phases to each other from the collector and emitter of the phase split transistor. In accordance with this method, however, the resistance values of the collector- and emitter-load resistors must be made relatively small in order to enable the high speed operation. For this reason, the power consumption increases especially at the time of the low level signal. In the level conversion portion 1 shown in FIG. 8, on the other hand, it is possible circuit-wise to eliminate such increase of the power consumption.

In the circuit of this embodiment (FIG. 8), the bias portion 2 is interposed electrically between the positive power source voltage V_(CC) and the negative power source voltage -V_(EE). The bias portion 2 comprises a voltage division circuit consisting of the resistors R₇ and R₈, the diodes D₁₁ -D₁₃ and the resistor R₉, and an emitter follower circuit consisting of the transistor Q₄ and the resistor R₁₀. The bias portion 2 generates a bias voltage V_(N4) for the protection transistor Q₁₂ and a bias voltage V_(N5) for the transistor Q₁₀ that drives the current source transistor Q₁₅. Accordingly, even when the absolute value |V_(EE) | of the negative power source voltage -V_(EE) decreases below about 4 V, it never happens that the protection transistor Q₁₂ and the constant current transistor Q₁₅ are turned off. As represented by characteristics l₇₂ in FIG. 7, for example, even when the negative power source voltage -V_(EE) approaches the ground potential (GND), both transistors Q₁₂ and Q₁₅ are never turned off. In consequence, the margin of a reduced voltage of the protection circuit with respect to the power source voltage -V_(EE) can be expanded and circuit design can be markedly simplified.

However, even when the protection transistor Q₁₂ and the differential transistor Q₁₄ are in the ON state, the output voltage V_(N1) at the node N₁ rises as represented by the characteristic l₇₂ in FIG. 7 if the absolute value |V_(EE) | of the power source voltage -V_(EE) drops and approaches the ground potential (GND). If the power source voltage detection portion 5 is not connected at this time, the transistors Q₁₆ and Q₁₇ are sometimes turned on.

For, in the circuit shown in FIG. 8, when the absolute value |V_(EE) | of the negative power source voltage -V_(EE) becomes a small voltage value, a sufficient bias voltage is no longer fed to the transistor Q₁₀ of the bias portion 3 with the consequence that the emitter output current of the abovementioned transistor Q₁₀ decreases and the collector current of the current source transistor Q₁₅ of the level conversion portion 1 decreases in the corresponding manner.

Assume, for example, that one Q₁₃ of the differential pair transistors Q₁₃ and Q₁₄ of the level conversion portion 1 is in the ON state in response to the low level signal of the ECL level of the input A. In this case, the voltage drop through the resistor R₁₉ decreases to correspond to the decrease in the collector current of the current source transistor Q₁₅. As a result, the potential of the low level signal V_(N2) at the node N₂ rises and the transistors Q₁₈ and Q₁₉ become conductive correspondingly. Hence, the potential level at the output terminal P₂ is caused to lower towards an undesirably low level.

On the contrary, if the other transistor Q₁₄ of the differential pair transistors Q₁₃ and Q₁₄ is brought into the ON state by the high level signal of the input A or if the protection transistor Q₁₂ is in the ON state due to the opening of the input terminals P₄ and P₅, the voltage drop through the resistor R₂₀ decreases in response to the decrease in the collector current of the current source transistor Q₁₅ with the consequence that the potential V_(N1) of the low level signal at the node N₁ rises and the transistors Q₁₆ and Q₁₇ become conductive correspondingly. As a result, the level of the potential at the output terminal P₂ is caused to rise towards an undesirably high level.

Further, in the circuit of this embodiment (FIG. 8), if the positive power source voltage V_(CC) rises beyond a predetermined normal range while the power source voltage detection portion 5 is not connected, the circuits such as the TTL circuit and the N-MOS circuit do not operate, or operate erroneously, at times. In other words, if the positive power source voltage V_(CC) rises while deviating from the predetermined normal range, the potential level at both nodes N₁ and N₂ become high levels at times. This is because the value of the voltage drop at the resistor R₁₉ or R₂₀ is substantially set to a predetermined value that is determined by the constant current of the current source transistor Q₁₅. Namely, when the input signal to the input A is at low level, the low level signal potential V_(N2) at the node N₂ increases with the increase of the power source voltage V_(CC) for the abovementioned reason. As a result, the transistors Q₁₈ and Q₁₉, that should be in the OFF state, start becoming conductive along with the increase of the potential V_(N2) at the node N₂. Hence, the potential level at the output terminal P₂ is caused to lower towards an undesirably low level.

On the other hand, the high level signal potential produced at the output terminal P₂ is determined in accordance with the positive power source voltage V_(CC). If the positive power source voltage V_(CC) drops from the predetermined normal range, the high level of the signal produced at the terminal P₂ can not be regarded as a definitely high level with respect to the TTL circuit and to the N-MOS circuit.

When the signal at the terminal P₂ is at an undesirable level due to the rise or fall of the positive power source voltage V_(CC) as described above, the TTL circuit and the N-MOS circuit that receive the signal at the terminal P₂ do not operate or operate erroneously.

Further, in the embodiment of the invention (FIG. 8), if the power source voltage detection portion 5 is not connected, the level of the signals at the nodes N₁ and N₂ become simultaneously high level at times when the positive power source voltage V_(CC) and the negative power source voltage -V_(EE) are applied. In other words, the time required for a voltage to reach a normal value from making of the positive power source is different from that of the negative power source depending upon the circuit constructions of the two circuits receiving the positive and negative power source voltages, respectively. If making of the negative power source voltage is delayed substantially as compared with that of the positive power source voltage, the signal levels of the nodes N₁ and N₂ become high level substantially simultaneously within this delay time.

As described above, in the circuit of this embodiment (FIG. 8), if the power source detection portion 5 is not connected, the signal levels at the nodes N₁ and N₂ sometimes become high level substantially simultaneously owing to the difficiency of the negative power source voltage V_(EE) or to the excess of the positive power source or in accordance with the sequence of the feed of the two power sources. In consequence, the signal level at the output terminal P₂ is changed undesirably and the push-pull output transistors Q₁₇ and Q₁₉ cascaded between the positive power terminal P₁ and the ground terminal P₃ are simultaneously turned on. When both output transistors Q₁₇ and Q₁₉ are simultaneously turned on, a penetrating current flows from the power source V_(CC) to the output transistors Q₁₇ and Q₁₉, which penetrating current causes degradation or break-down of these transistors Q₁₇ and Q₁₉.

In order to prevent the degradation or break-down of the output transistors Q₁₇ and Q₁₉, it is theoretically possible to reduce the penetrating current by interposing a current limiting resistor between the cascade line of the output transistors Q₁₇ and Q₁₉. In accordance with this method, however, the output current at the output terminal P₂ is restricted by the current limiting resistor even when the circuit operates normally. Hence, when the capacitive load is connected to the output terminal P₂, for example, it is difficult to supply the capacitive load with signals that vary at a high speed.

In accordance with the embodiment of the invention (FIG. 8), however, it is possible to prevent the undesirable change of the output signal level at the output terminal P₂ as well as the occurrence of the penetrating current without using the current limiting resistor that would otherwise cause the abovementioned problem, by means of its power source voltage detection portion 5.

As shown in FIG. 8, this power source voltage detection portion 5 consists of resistors R₁₁ -R₁₃ and transistors Q₅ -Q₈. As the power source voltage detection portion 5 is connected as shown in the drawing, the transistors Q₆ and Q₈ are turned on when the value of the bias voltage V_(N3) at the node N₃ of the aforementioned bias portion 2 becomes greater than the sum 2V_(BE) of the base-emitter voltages of the transistors Q₆ and Q₈ in the forward directon, and are turned off when the former is smaller than the latter.

As described above, the value of the bias voltage V_(N3) at the node N₃ is smaller than 2V_(BE) when both positive and negative power source voltages are within suitable ranges, respectively. Under this state the transistor Q₈ is in the OFF state and does not perform any function to restrict the signals that appear at the node N₁ of the level conversion portion 1.

When the positive power source voltage V_(CC) becomes excessively great or when the absolute value |V_(EE) | of the negative power source voltage -V_(EE) becomes excessively small, the bias voltage V_(N3) at the node N₃ becomes greater than 2V_(BE), and the transistor Q₈ is turned on in response thereto.

The potential of the level at the node N₁ of the level conversion portion 1 is rendered substantially equal to the low level of the ground potential (GND) by the transistor Q₈ which is in the ON state as described above. As a result, the potential levels at the nodes N₁ and N₂ are prevented from becoming high levels simultaneously.

The present invention is not particularly restricted to the above-mentioned embodiment (FIG. 8), and the definite construction of the bias circuits for the protection transistor Q₁₂ and the current source transistor Q₁₅ may be modified variously. Other protection circuits such as the power source voltage detection circuit may also be optional.

The present invention can be widely used for the circuit which converts a signal of one polarity to a signal of the other polarity. 

What is claimed is:
 1. A level conversion circuit for deriving an output signal having a positive level from an input signal having a negative level comprising:first and second input transistors having the emitters thereof connected to one another; a first load resistor connected between the collector of said first input transistor and a positive power source voltage terminal; a second load resistor connected between the collector of said second input transistor and said positive power source voltage terminal; a current source transistor connected between the emitters of said first and second input transistors and a negative power source voltage terminal; an output circuit connected between said positive power source voltage terminal and a ground potential terminal, said output circuit being connected to receive signals from the collectors of said first and second input transistors and to produce said output signal; a bias circuit feeding a first bias voltage to the base of said current source transistor, said bias circuit being connected between said positive power source voltage terminal and said negative power source voltage terminal; and a third transistor receiving at the base thereof a second bias voltage generated by said bias circuit and having the collector and emitter thereof connected to the collector and emitter of said second input transistor, respectively.
 2. The level conversion circuit as defined in claim 1, wherein said output circuit comprisesa first emitter follower transistor having the base thereof connected to the collector of said first input transistor; a second emitter follower transistor having the base thereof connected to the collector of said second input transistor; and first and second output transistors cascaded between said positive power source voltage terminal and said ground potential terminal; the bases of said first and second output transistors connected to the emitters of said first and second emitter follower transistors, respectively.
 3. The level conversion circuit as claimed in claim 2 which further includes:a first switching transistor having the collector thereof connected to the base of said second emitter follower transistor and the emitter thereof connected to the ground potential terminal; a fourth transistor receiving at the base thereof a third bias voltage generated by said bias circuit; and a third resistor connected between the collector of said fourth transistor and said positive power source voltage terminal; the collector output signal of said fourth transistor being impressed upon the base of said first switching transistor so that when said negative power source voltage drops, said fourth transistor is brought into the cut-off state before said current source transistor is cut off, thereby bringing said first switching transistor into the on state.
 4. The level conversion circuit as defined in claim 3 which further includes:a second switching transistor having the collector thereof connected to the base of said first emitter follower transistor and the emitter thereof connected to the ground potential terminal; a fifth transistor having the emitter thereof connected to said bias circuit; a fourth resistor connected between the base of said fifth transistor and said positive power source voltage terminal; and means for transmitting the collector output signal of said fifth transistor to the base of said second switching transistor.
 5. The level conversion circuit as defined in claim 2 which further includes an output terminal connected to the collector of said first output transistor and to the emitter of said second output transistor, wherein the output signal of said level conversion circuit is fed out from said output terminal and is impressed upon the input terminal of an N-MOS memory.
 6. The level conversion circuit for deriving an output signal having a positive level from an input signal having a negative level comprising:first and second input transistors having the emitters thereof connected to one another; a first load resistor connected between the collector of said first input transistor and a positive power source voltage terminal; a second load resistor connected between the collector of said second input transistor and said positive power source voltage terminal; a current source transistor connected between the emitters of said first and second input transistors and a negative power source voltage terminal; an output circuit connected between said positive power source voltage terminal and a ground potential terminal, said output circuit being connected to receive signals from the collectors of said first and second input transistors and to produce said output signal; a bias circuit feeding a first bias voltage to the base of said current source transistor, said bias current being connected between said positive power source voltage terminal and said negative power source voltage terminal, wherein said output circuit comprises first and second output transistors cascaded between said positive power source voltage terminal and said ground potential terminal, the collector output signal of said first input transistor being impressed upon the base of said first output transistor, and the collector output signal of said second input transistor being impressed upon the base of said second output transistor. 